SERVICES
Item | TSMT Capability |
SMT ( pick & place) | Mounting Accuracy : +/-0.05mm (CM602), +/-0.04mm (NPM) |
Chip Component | Min : 0201 / 01005 |
IC (BGA/aQFN) | Min : Pitch 0.30mm, ɸ0.20mm, >1000 balls (BGA) |
LED | Min : 0.25t (Top View), 0.3t (Side View), mini LED size : 5x9mil (sample) |
LED bar related spec. | Co-linearity : +/- 0.1mm, Angle Tilt : +/-3°, Angle Rotation : +/-2° |
Lens | Lens center to LED center shift : +/- 0.075mm |
PCB | Max length : 1200mm, Max width : 460mm / experience layer : 16L |
Glue Dispensing | Dispensing Accuracy: +/-0.02mm |
Special Process | Hot Bar bonding, ACF bonding, COF puncher, Potting Process,Aging Room. Laser printing, die-bonding, wire-bonding, IEC17025 Lab (CNAS Lab) |
Carrier Types | Regular-type (T ≥ 0.8mm), Spring-type (0.8mm > T > 0.4mm), Magnetic-type (T ≤ 0.4mm)with metal film (min thickness = 0.05mm) |